Spain’s Centro Español de Metrología becomes the first in Europe to deploy Mitutoyo’s LEGEX TAKUMI, setting a new benchmark for absolute coordinate measurement accuracy.
Designed to compensate for installation deviations, vibration, and thermal expansion, the mechanism supports efficient liquid cooling deployment at scale.
Rheinmetall develops a new electrode technology for alkaline electrolysis within Germany’s National Hydrogen Strategy, targeting higher efficiency and scalable green hydrogen production.
Telit Cinterion and Nokia are collaborating to integrate multi-access wireless connectivity with in-network edge computing for mission-critical industrial operations.
The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.
Rosenberger Optical Solutions & Infrastructure implements large-scale AI data centre cabling projects across Europe in cooperation with a leading AI computing provider and end customer Microsoft.
Aerotech Inc. introduces the AGV-CPO 2-axis laser scan head to extend high-performance galvo scanning to a broader range of laser micromachining applications.
Innolux presents next-generation display technologies integrating MicroLED and naked-eye 3D to support retail, cockpit, and smart device applications at CES 2026.
Exxelia has developed a new Smart Integrated Magnetics solution designed for advanced power conditioning and distribution units (PCDUs) operating in constrained and demanding environments such as space systems.