Fraunhofer IFF develops a sensor-based system with AI analytics to monitor photovoltaic plants at module level, improving fault detection, performance transparency, and predictive maintenance.
Siemens extends its industrial private 5G infrastructure to new markets, enabling deterministic wireless connectivity and edge-based data processing for manufacturing environments.
binder introduces a new triangular moulding concept for M12 and M16 connectors, enhancing durability, handling and performance in dynamic industrial environments.
Branson Polaris Ultrasonic Welding Platform delivers a flexible, scalable and future-proof approach to joining a variety of materials in product packaging and other uses.
Software-based virtual sensor predicts paper strength properties continuously, enabling process optimization, reduced raw material use, and improved production efficiency.
Balluff introduces SmartLight Rigid, a space-efficient signaling device with IO-Link connectivity for machine status visualization in industrial and intralogistics applications.