New capabilities could enable a multitude of robotic applications, ranging from non-destructive inspection and repair of industrial infrastructure pipe inspection to supporting wireless infrastructure construction.
Rutronik Elektronische Bauelemente GmbH has signed a worldwide distribution agreement with one of China's leading SoC suppliers, Fuzhou Rockchip Electronics Co, Ltd. Thus, Rutronik is the authorized distributor from Europe in the Rockchip distribution network.
Amidst the COVID-19 pandemic where the ability to work from home has become an absolute necessity, NEXCOM can now help telecom and data centers across the world virtualize and expand capacity with its new NC 220FMS3 100GbE NIC module.
The Siemens’ Packaging Toolbox is now available in its entirety for the Simatic S7-1500 controller in the TIA Portal engineering framework. It offers users packaging specific libraries which can be integrated into existing or new machine applications as well as program blocks. The Toolbox supports international standards such as OMAC, PackML and Weihenstephan Standards. By adding or modifying function blocks it can be adapted to suit individual requirements, while at the same time saving the user time during engineering and commissioning through tested functions and software solutions.