New heat conducting material in foil form

Air pockets in the thermal contacting of an electronic device on a heat sink, such as a heatsink, cooling aggregate or liquid heatsink, significantly reduce the heat transfer resistance. The air cushions in the gaps between the contact pairing are caused by production-related manufacturing tolerances and must be equalized, as the air would otherwise act as a thermal insulator.

In order to optimize these heat transfer resistances in particular, Fischer Elektronik GmbH & Co. KG is expanding its already extensive product portfolio to include further innovative and technically high-performance heat conducting foils with the designation WFP 30... and WFP 30...K. Both designs are a glass-fiber reinforced silicone film, with the suffix “K” indicating an additional adhesive coating for easy installation handling.

The new heat-conducting films are available in material thicknesses of 0.2, 0.3 and 0.45 mm and also have very good heat dissipation and insulation properties. The material is soft and elastic and adapts perfectly to the surfaces to be contacted even with very low contact pressure. The new thermal conductive foils WFP 30... series are UL 94 V-0 listed and have an operating temperature range of -40°C to +150°C. The basic material of the heat-conducting foils is available from stock as roll material with a roll width of 150mm. Cuts to length and customer-specific contours according to drawing specifications are also realized at Fischer Elektronik.

In addition, we offer a free 24-hour sample service for initial test and prototype parts according to your application-specific drawing template. The required cut-to-size heat-conducting material is produced directly from your CAD data in the form of a DXF file using a digital cutter and sent to you immediately.

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