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Modular platform for heating and cooling in metal and plastic processing

Exact temperature control is a critical factor in many industrial metal and plastic processing sequences. In these scenarios, the requirements regarding temperature control can vary substantially depending on the production conditions.

Modular platform for heating and cooling in metal and plastic processing
However, what is always required are solutions that guarantee one-hundred-percent repeatability wherever possible to ensure high product quality. They must also be simple to integrate and capable of being extended or converted as required.

The modular temperature control platform developed by Bürkert Fluid Control Systems, which permits seamless adjustment to suit the most varied processes, was designed precisely with these requirements in mind. It is based on a broad range of electromotive and pneumatic valves as well as various measurement principles, e.g. for coolant flows (ultrasound and paddle wheel), air quantities (thermal sensor) as well as pressure and temperature.

Supplied as a custom assembled complete system, the temperature control can then easily be integrated into the most diverse applications.

Service-friendly, leak-free and efficient

Thanks to the modular design, individual valve clusters can easily be realised, as can multi-channel media distribution systems or complete media cabinets – always adapted to meet individual requirements. The user avoids the need to install piping between individual valves and dead spaces are reduced thanks to the compact design.

In contrast to discrete assembly solutions, this allows the valve block to be placed close to the tool. Since the very compact design also reduces the heat-radiating surfaces, energy efficiency improves accordingly. The service-friendly structure also makes it easier to replace individual components. Orbital welding seams and high-temperature graphite seals that can also withstand extreme temperature differences guarantee leak-free operation.

The Bürkert EDIP (Efficient Device Integration Platform) can be used to connect the temperature control to all standard bus systems; the wiring complexity is reduced, start-up and parameterisation are simple. Depending on the tool and process, temperatures can be specified, the flow control set automatically, or a constant pressure maintained.

Once parameters have been stored, they can be restored at any time. All things considered, the temperature control processes are reliably repeatable which boosts product quality and eliminates waste.

www.burkert.com


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