Binder News

Designed for power applications in North America

Use in control cabinets for the North-American market requires specific testing and certification of the components. In the case of power applications, they are subject to the UL 2237 standard. binder's 823 and 824 series of compact cable connectors have been developed according to this standard.

Hitachi News

Hitachi High-Tech Launches Dark Field Wafer Defect Inspection System DI2800, Achieving High-Sensitivity 100% Inspection for Semiconductor Devices in the IoT and Automotive Fields

Helping to improve the reliability and safety of semiconductor devices in the IoT and automotive fields. Hitachi High-Tech Corporation has announced the launch of the Hitachi Dark Field Wafer Defect Inspection System DI2800, a critical component in any semiconductor manufacturer's metrology capabilities.

Texas Instruments News

New processors make edge AI more accessible while cutting power consumption in half

Expanding on its history of delivering highly integrated processors, Texas Instruments (TI) today introduced new Sitara AM62 processors that help expand edge artificial intelligence (AI) processing into next-generation applications. The low-power design of the new processors enables support for dual-screen displays and small-size human-machine interface (HMI) applications.

TWK News

Safety and even more safety: CANopen Safety - SIL3

TWK takes the next step in the direction of 'safety in sensor technology' and introduces the new sensor model TxSN with magnetic sensor system in the series of functionally safe sensors with the established interface standard CANopen Safety (EN 50325-5).

Axivion News

Axivion Suite – Continuous Quality for an Agile DevOps World

At embedded world 2022, Axivion, a provider for innovative software solutions for static code analysis and protection from software erosion, will present the latest release of Axivion Suite. The tool suite for static code analysis and architecture verification now offers a convenient project setup wizard, even more DevOps integration options and a broader rule coverage for more software security and freedom from interference.

SMB Bearings News

Resolving the global semiconductor shortage

Semiconductor chips store data on almost every modern digital device that we use. According to ASML, in 2020, more than one trillion chips were produced around the world. Despite their use in many of the products we rely on, the manufacturing process is complex and requires precision.

WAE News

Williams Advanced Engineering (WAE) and Imperial College London supporting Faraday Institution funded BESAFE project to advance the understanding of the initiation and propagation of thermal runaway

Imperial College London and Williams Advanced Engineering (WAE) are working on a project to bridge the gap between thermofluid science and battery electrochemistry; developing a first-of-a-kind multiphase multiphysics model of battery failure via thermal runaway (a self-sustaining cascade of exothermic reactions that produce large volumes of gas).

Join the 155,000+ IMP followers