Siemens is expanding its distributed I/O system with new modules for the Simatic ET 200MP/Simatic S7-1500 IOs as well as a backplane bus.
Siemens is expanding its distributed I/O system with new modules for the Simatic ET 200MP/Simatic S7-1500 IOs as well as a backplane bus. A total of four new multi-channel digital modules, with 64 channels each and an installation width of 35 millimeters, enables users to achieve space-saving and cost-efficient implementation of a high number of channels in the control cabinet. This reduces the footprint of their Simatic S7-1500 stations. Particularly existing systems on the basis of Simatic S7-300/ET 200M are easy to migrate to the new Simatic S7-1500 systems with the new portfolio.
Hot-swapping of modules is also possible in combination with the new active backplane bus for the Simatic S7-1500 or Simatic ET 200MP. This means that users can replace any faulty Simatic ET 200MP modules during the CPU runtime, i.e. during ongoing plant operation, while non-affected modules remain operational, thus increasing your plant availability. The new portfolio makes the Simatic ET 200MP ideal for use in the process environment together with Simatic S7-1500R/H systems since it promotes high channel density and high levels of availability.
With the Simatic TOP Connect system cabling, users also benefit from short installation times for the new digital modules since no tools are required.