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Balluff Wafer Mapping Sensor Delivers Precision in the Smallest Spaces

Balluff’s new wafer mapping sensor, BOH00EZ, utilizes a highly precise photoelectric sensor for quick and reliable detection of semiconductor wafers and slotting errors in FOUPS – front opening unified pods.

Balluff Wafer Mapping Sensor Delivers Precision in the Smallest Spaces

Specially designed for use with extremely thin end effectors, it features an extremely controlled and focused light spot, allowing it to detect wafers even just a few μm thick with extreme precision.

Based on photoelectric Micromote technology, it features the smallest LED sensor on the market in an impressively small sensor head – measuring in at just 2.4 x 1.5 x 7 mm. This allows it to deliver precision in even the smallest spaces.

In addition to wafer mapping, this sensor delivers capabilities that can be used for a variety of applications that require through beam sensors in a small area, such as Life Science and Food and Beverage applications.

Key features:

  • Multi-functional sensor head
  • Smallest LED sensor on the market
  • Very compact, extremely flexible sensor cable
  • Flexible adaptation to the respective application using an external amplifier

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