21
'20
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Congatec News
21
'20
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innodisk
Innodisk Supports Healthcare Industry with Capable Medical-grade Solutions
Innodisk meets growing healthcare industry demands with DRAM modules, flash storage devices, and embedded peripherals optimized for medical use.
21
'20
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Rutronik News
Rutronik and SoC supplier Rockchip sign global distribution agreement
Rutronik Elektronische Bauelemente GmbH has signed a worldwide distribution agreement with one of China's leading SoC suppliers, Fuzhou Rockchip Electronics Co, Ltd. Thus, Rutronik is the authorized distributor from Europe in the Rockchip distribution network.
21
'20
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VIDEOJET News
Videojet upgrades the 9550 Label Print and Apply (LPA) system with a new 6” printhead option
Innovatively designed, Videojet® 9550 LPA system increases reliability, efficiency and productivity for outer case and bundle packaging.
21
'20
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HMS Industrial Networks AB
Powerful CAN-FD multi-channel Ixxat PC-interface for automotive test systems and industrial applications
HMS Networks now extends its Ixxat® PC-interface portfolio with the multi-channel interface CAN-IB 640/PCIe that offers four channels each for CAN-FD/CAN and LIN connectivity.
21
'20
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SCHUNK News
Magic of tombstones and pyramids
The compact, spring-actuated TANDEM KSF plus clamping force blocks require no media supply, and are therefore ideal for storage solutions.
21
'20
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Stemmer imaging News
STEMMER IMAGING STARTS DISTRIBUTING AUTOMATION TECHNOLOGY'S FEBRISCAN EBT SYSTEM
STEMMER IMAGING AG has signed an agreement with Automation Technology for the distribution of it’s FebriScan systems - complete LWIR camera solutions for detecting elevated human body temperatures.
21
'20
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Nexcom News
NEXCOM Solves COVID-19 Related Network Capacity Issues with New 100GbE NIC Module
Amidst the COVID-19 pandemic where the ability to work from home has become an absolute necessity, NEXCOM can now help telecom and data centers across the world virtualize and expand capacity with its new NC 220FMS3 100GbE NIC module.
21
'20
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Siemens News
Packaging Toolbox enables easy engineering of packaging machines
The Siemens’ Packaging Toolbox is now available in its entirety for the Simatic S7-1500 controller in the TIA Portal engineering framework. It offers users packaging specific libraries which can be integrated into existing or new machine applications as well as program blocks. The Toolbox supports international standards such as OMAC, PackML and Weihenstephan Standards. By adding or modifying function blocks it can be adapted to suit individual requirements, while at the same time saving the user time during engineering and commissioning through tested functions and software solutions.
20
'20
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ST News
