Temposonics News

One sensor with IO-Link and eight positions to measure? Now possible!

Temposonics, company of the Amphenol Group, announces the expansion of the Temposonics® E-Series IO-Link for industrial applications. These linear position sensors with IO-Link are now available with multi-position measurement, enabling the detection and output of up to eight positions simultaneously.

Schlumberger News

Olivier Le Peuch on digital’s role in the low carbon energy future

Olivier Le Peuch has been both a witness and a participant in the industry’s digital evolution over his thirty-five-year career at Schlumberger. Today, as the company’s chief executive officer, he sees digital as a great “accelerator” for the industry to address the dual energy access and climate challenges the world is facing.

Siemens digital Industry Software News

Siemens collaborates with UMC to develop 3D integrated circuit hybrid bonding workflow

Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.

Baslerweb News

Basler Announces Vision Compatibility for New NVIDIA Jetson Orin Nano Edge AI Platform

Basler will be introducing Add-on Camera Kits with 5 and 13 MP to support the NVIDIA® Jetson Orin Nano system-on-modules (SOMs), which have set a new baseline for entry-level edge AI and robotics, as announced today at NVIDIA GTC. Add-on Camera Kits are ready-to-use vision extensions that include an adapter board, camera, lens, and cables.

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