03
'22
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Intel News
03
'22
Written on
Leica Geosystems News
Leica Geosystems announces major performance increase in airborne bathymetric survey
The new Leica Chiroptera-5 bathymetric LiDAR sensor provides 40% higher point density, a 20% increase in water depth penetration and improved topographic sensitivity for generating more detailed hydrographic maps.
03
'22
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GF MACHINING SOLUTIONS News
GF Machining Solutions and GF Casting Solutions present their unique aerospace capabilities at Farnborough International Airshow 2022
At Farnborough International Airshow 2022 (18–22 July 2022), GF Machining Solutions and GF Casting Solutions will demonstrate their expertise in the aerospace industry in Hall 4, Stand 41150.
03
'22
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Safran News
Safran invests in Sintermat, a deep-tech startup specialized in innovative materials
Safran Corporate Ventures announced today that it has made a joint investment with partners in the company Sintermat, as part of a funding round exceeding 6 million euros.
03
'22
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MAPLESOFT News
New MapleSim release from Maplesoft provides an enhanced multidomain modeling tool that helps designers build better machines
Maplesoft today announced a new release of MapleSim that makes it even easier for engineers to improve the design of machines that incorporate elements from multiple engineering domains. MapleSim is an advanced modeling and simulation tool that helps machine designers reduce development time, lower costs, and diagnose real-world performance issues, with its flexible modeling environment, built-in analysis tools, and connectivity to automation systems.
03
'22
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Binder News
Designed for power applications in North America
Use in control cabinets for the North-American market requires specific testing and certification of the components. In the case of power applications, they are subject to the UL 2237 standard. binder's 823 and 824 series of compact cable connectors have been developed according to this standard.
03
'22
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Hitachi News
Hitachi High-Tech Launches Dark Field Wafer Defect Inspection System DI2800, Achieving High-Sensitivity 100% Inspection for Semiconductor Devices in the IoT and Automotive Fields
Helping to improve the reliability and safety of semiconductor devices in the IoT and automotive fields. Hitachi High-Tech Corporation has announced the launch of the Hitachi Dark Field Wafer Defect Inspection System DI2800, a critical component in any semiconductor manufacturer's metrology capabilities.
03
'22
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Texas Instruments News
New processors make edge AI more accessible while cutting power consumption in half
Expanding on its history of delivering highly integrated processors, Texas Instruments (TI) today introduced new Sitara AM62 processors that help expand edge artificial intelligence (AI) processing into next-generation applications. The low-power design of the new processors enables support for dual-screen displays and small-size human-machine interface (HMI) applications.
03
'22
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TWK News
Safety and even more safety: CANopen Safety - SIL3
TWK takes the next step in the direction of 'safety in sensor technology' and introduces the new sensor model TxSN with magnetic sensor system in the series of functionally safe sensors with the established interface standard CANopen Safety (EN 50325-5).
03
'22
Written on
U Blox News
