Vishay Intertechnology has announced that it has upgraded its TFBS4xx and TFDU4xx series of infrared (IR) transceiver modules for IrDA® applications to offer 20 % longer link distance and improved ESD robustness to 2 kV.
Flexxbotics has announced it will demonstrate its breakthrough solutions for advanced robotic machine tending at the Universal Robots Innovate to Elevate online event on March 21, 2024.
ADLINK will be debuting its OSM product line of embedded modules in a versatile standard for small-size and low-cost soldered-down including the OSM-IMX93 (NXP i.MX 93), OSM-IMX8MP (NXP i.MX 8M Plus) at Embedded World 2024, Hall 3, Booth 147.